Flexible Tip Syringe Solder Paste Flux 10cc RMA-223 PCB PGA BGA SMD

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In stock


مادة الـ RMA-223 والخاصة بمساعة اللحام. مادة لاصقة مع فلكس تستخدم في الـ PCB و الـBGA والـ PGA وهو من الادوات المهمة جدا في لحام المواد الالكترونية الدقيقة في لوحات الحاسوب ولوحات الموبايل وغيرها. عبارة عن سرنجات عدد 2 مع اداة الدفع ومنافذ متغيرة الشكل مرنة لتوصيل المادة الى المناطق الدقيقة جداً. تحتوي كل سرنجة على 10 مل من المادة.

3,500 ع.د

In stock

Flexible Tip Syringe Solder Paste Flux 10cc RMA-223 PCB PGA BGA SMD

The RMA-223 is a high viscosity no-clean flux, it can be used for PCB, BGA, PGA reworking. It can be used for soldering and reballing of computer and phone chips. It has a high viscosity no-clean flux. It is the mixture of high-quality alloyed powder and resinic pasted flux.

Features:
Suitable for BGA ball, semiconductor packaging, repair.
Computer motherboard north and south bridge, communications, graphics and other BGA apply.
Just apply a little each time.
It’s currently the best on the market BGA, CSP rework help paste.
When the bumping of the BGA chip coated with flux paste and PCB pads are required coat.
Good BGA soldering flux paste and machine regardless of manual welding, the success rate is greatly increased.

Specifications:
Material: tin+ solder paste
Capacity: 10cc/10ml
Size: Approx.: 3.3×3.2×2.9cm

Package Includes:
1 x 10cc RMA-223 PCB Solder Paste
1 x Syringe push
1 x Blunt end tip

SKU: 223 Category:
  • Material: tin+ solder paste
  • Capacity: 10cc/10ml
  • Size: Approx.: 3.3×3.2×2.9cm

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